|Product Name||Industry Approval||Description|
|VT-481||IPC-4101E /97 /98 /99 /101||Phenolic Cured, Filled FR4.0 Tg 155|
|VT-47||IPC-4101E /97 /98 /99 /101 /126||Phenolic Cured, Filled, Low CTE FR4.0 Tg 180|
|Hole Fill Prepreg||IPC-4101E||Lead-Free High Tg FR4 Prepreg, UL-V0 Polyimide Ceramic Filled Prepreg optimized for filling Metal Core PCBs|
Organic FR4 phenolic cured substrates and ceramic-loaded hole-fill prepregs for environmentally conscious assembly offer choice, strength, resilience and stability over temperature, including high Tg and low CTE, for high reliability and assembly integrity.